JPH0273763U - - Google Patents
Info
- Publication number
- JPH0273763U JPH0273763U JP15348688U JP15348688U JPH0273763U JP H0273763 U JPH0273763 U JP H0273763U JP 15348688 U JP15348688 U JP 15348688U JP 15348688 U JP15348688 U JP 15348688U JP H0273763 U JPH0273763 U JP H0273763U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- circuit layer
- hole
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15348688U JPH0273763U (en]) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15348688U JPH0273763U (en]) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273763U true JPH0273763U (en]) | 1990-06-05 |
Family
ID=31429368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15348688U Pending JPH0273763U (en]) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273763U (en]) |
-
1988
- 1988-11-28 JP JP15348688U patent/JPH0273763U/ja active Pending